Electroplating of Aerosol Jet‐Printed Silver Inks

Aerosol jet printing of silver inks is a promising approach for 3D electronics, particularly obtaining very complex circuits with high‐resolution conductive pads and traces. Common are however not competitive traditional bulk metal conductors, requiring sintering at high temperatures as well having significant porosity that can result in early failure. Herein, the possibility using electroplating to deposit copper on aerosol jetted investigated, more than an order magnitude reduction electrical resistivity shown. The plating rate, resistivity, adhesion characterized, along morphology resulting deposits. This then shown allow high‐strength soldering electroplated traces, demonstrating capability this technology integration soldered surface mount components jet‐printed electronics.